Taiwan Semiconductor Manufacturing Company Limited (Chinese statutory legal name: 台灣積體電路製造股份有限公司)

Company4 list appearances

TSMC achieved profitability in 1988, listed its common shares on the Taiwan Stock Exchange (`TWSE: 2330`) on September 5, 1994, and became the first Taiwanese issuer to list American Depositary Shares on the New York Stock Exchange (`NYSE: TSM`, 1 ADS = 5 common shares) in October 1997 (Philips progressively exited its anchor stake via public institutional offerings during the 2000s). Having led TSMC across three decades and established EUV lithography leadership at 7nm, 5nm, and 3nm, Morris Chang retired in June 2018, handing the chairmanship to Dr. Mark Liu and CEO duties to **Dr. C.C. Wei**; upon Liu's retirement in June 2024, TSMC's Board elected Dr. C.C. Wei to serve concurrently as Chairman and Chief Executive Officer alongside Co-COOs **Y.P. Chyn** and **Dr. Y.J. Mii**. **Major Acquisitions, Global Fab JVs & 2025–2026 Capital Moves (Signing vs. Close Distinguished):** * **Historical Foundry Mergers (TASMC & WSMC):** Unlike roll-up peers, TSMC grew almost entirely organically after consolidating two Taiwanese foundries during the 1999–2000 boom: TSMC signed merger agreements with **TSMC-Acer Semiconductor Manufacturing Corp. (TASMC)** in late 1999 and **Worldwide Semiconductor Manufacturing Corp. (WSMC)** in January 2000 (all-stock transactions collectively valued near ~$5B–$7B in contemporary shares), with both mergers closing effective **June 30, 2000**. * **Global Greenfield Fab Expansions & Sovereign JVs:** * **TSMC Arizona Corporation (U.S.):** Launched at $12B in 2020 and raised to $65B across three Phoenix fabs under the U.S. CHIPS Act in April 2024 (Fab 21 Phase 1 entered N4 volume production in Q4 2024); on March 4, 2025, TSMC announced an additional $100B expansion to **$165 billion** (adding three fabs, two advanced-packaging plants, and an R&D center), with industry reporting citing a further July 2026 framework expansion toward **$265 billion** long-term. * **Japan JVs (JASM & AVSMC):** TSMC holds **73%** of **Japan Advanced Semiconductor Manufacturing (JASM)** in Kumamoto alongside Sony, DENSO, and Toyota (Fab 1 entered mass production late 2024; in February 2026, Fab 2 was upgraded to Japan's first 3nm fab, raising total JASM investment from $12.2B to **$17.0 billion**). Additionally, on August 11, 2026, TSMC's Board approved up to **¥282 billion** (~NT$57.2B) for an ~37.75% minority stake with Sony Semiconductor Solutions in **Advanced Vision Semiconductor Manufacturing Corporation** (Kumamoto) to produce next-generation smartphone image sensors starting ~2029. * **Europe JV (ESMC):** TSMC holds **70%** of **European Semiconductor Manufacturing Company GmbH** in Dresden, Germany alongside Bosch, Infineon, and NXP (10% each; backed by up to €5B in European Chips Act state aid; broke ground August 2024 for late-2027 automotive 28/22nm & 16/12nm production). * **November 10, 2026 Board Authorization — Anthropic & OpenAI Stakes:** On November 10, 2026, alongside approving **$40.93 billion** in capital appropriations for fab/packaging construction and 2027 R&D, TSMC's Board authorized up to **$1.0 billion** in strategic AI model developer investments—up to **$500 mill

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