TSMC AI Chip Capacity Expansion

TSMC's AI chip capacity expansion adds 2.5 million wafers annually, a 40% increase that outperforms ASE Group Advanced Packaging in production speed. The new fabs achieve 99.5% yield rates for 3nm-class chips, cutting cost per transistor by 15%. This massive build-out meets surging demand for training chips like NVIDIA's H200, providing a 28% faster turnaround than the average foundry alternative, while delivering 20% better power efficiency per watt compared to Samsung's 3nm process.