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CoWoS Advanced Packaging
CoWoS (Chip-on-Wafer-on-Substrate) packaging is the backbone of AI accelerators, boosting memory bandwidth by 50% over traditional interposers. This technology integrates logic and HBM in a single package serving 60% of cloud AI workloads in 2026. It’s 30% denser than the average advanced packaging solution, offering a cost-efficient path for scaling GPU clusters.
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