ASE Group's advanced packaging pushes fan-out technology to integrate 12 dies per package, a 50% capacity increase over the industry standard. This innovation reduces signal loss by 35% compared to conventional embedded packaging, enabling higher bandwidth for AI accelerators. While #8 TSMC AI Chip Capacity Expansion focuses on raw silicon output, ASE's packaging directly improves system-level performance by 25%, achieving a 40% lower thermal resistance than the average competitive package.
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