3D IC Stacking (SoIC)

3D IC Stacking (SoIC) achieves a 40% reduction in interconnect length versus planar designs, slashing latency and energy use by 25%. By vertically stacking chiplets, it delivers 2x the performance density of #4 MediaTek’s Dimensity flagship, making it ideal for space-constrained AI and edge devices. This is a 50% yield improvement over earlier stacking methods.